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WPL Board Size 22" x 25.2" (560mm x 640mm) |
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Finish Thickness 0.01496" ~ 0.130" (0.38mm ~ 3.2mm) |
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PCB Layer Count 2-12Layers HDI ivh svh |
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Finish Copper 0.5 ~ 6.0 oz (17.0 ~ 210um) |
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Aspect Ratio 10:1 |
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Impedance Requirement 50 ohm ∮ 10%, 60 ohm ∮ 10% |
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the Tolerance of Board Thickness 10% |
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Min Finish Hole 0.004" (0.1mm) LASRE 0.1MM |
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Hole Position Alignment Extent ∮ 0.003" (0.075mm) |
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Min Trace / Gap of inner layer/ Gap of inner layer 0.003" / 0.003" (0.075mm / 0.075mm) |
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Min Trace / Gap of outer layer 0.003" / 0.003" (0.075mm / 0.075mm) |
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Min Ring Design 0.004" (0.1mm) |
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Min SM Ring at one Side Design 0.002" (0.05mm) |
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Min Solder Bridge Design 0.003" (0.075mm) |
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Plugging Hole 0.010" ~ 0.024" (0.2mm ~ 0.6mm) |
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Thickness of Gold Plating 2 ~ 40" |
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the thickness of immersion Gold 1 ~ 8" (藹硉 10 ~ 20") |
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the Height/Width of Silkscreen 0.006" (0.15mm) / 0.032" (0.8mm) |
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the Tolerance of CNC/PUNCH ∮ 0.004" (0.1mm) |
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O/S Condition 250V~300V 10M 30ohm |
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CAM Operation System Orbotech Genesis, Protel |
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surface finish Flux O.S.P, H.A.S.L (Pb/Sn), Immersion Gold/Silver/Tin, Gold Plating, Carbon Print , Peel able Mask,Lead Free H.A.S.L, |
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Base Material FR4, CEM-3, Hi-Tg, Hi-CTI, Halogen free, Aluminum board |